MaAnt BGA Reballing Stencils For Samsung (S/Note/A Series)

SKU
TOOL21156
Product Type
BGA Chip Ball Template Stencil
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Description
● High-quality steel sheet stencil, more durable ● Precise laser cutting for better alignment ● High-temperature resistance, not easy to get deformed ● The CPU and the common fault ICs are integrated into one stencil ● IC numbers are lasered on the stencil for reference, much easier to find
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  1. Compatible on multiple models
    iPhone 14 Plus, iPhone 14 Pro, iPhone 14 Pro Max, iPhone 13 Pro Max, iPhone 14, iPhone 13 Mini, iPhone 13 Pro, iPhone 13, iPhone 12 Pro Max, iPhone SE (2022), iPhone 12 Pro, iPhone 12 Mini, iPhone 12, iPhone SE (2020), iPhone 11 Pro Max, iPhone 11 Pro, iPhone 11