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Wylie BGA Reballing Stencil For iPhone - For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max

Wylie BGA Reballing Stencil For iPhone - For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max

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SKU

APP19785

Brand

Outils , Apple

Product Type

BGA Chip Ball Template Stencil

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Description

Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips. Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight. Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate. The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation - For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max