Wylie BGA Reballing Stencil For iPhone - For iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max

SKU
APP19775
Product Type
BGA Chip Ball Template Stencil
Quality
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Description
Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips. Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight. Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate. The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation - For iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max
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    Black
  2. Compatible on multiple models
    iPhone 13 Pro Max, iPhone 13 Mini, iPhone 13 Pro, iPhone 13, iPhone 12 Pro Max, iPhone 12 Pro, iPhone 12 Mini, iPhone 12, iPhone SE (2020), iPhone 11 Pro Max, iPhone 11 Pro, iPhone 11, iPhone XR, iPhone XS Max, iPhone XS, iPhone X, iPhone 8 Plus, iPhone 8, iPhone 7 Plus, iPhone 7, iPhone SE, iPhone 6S Plus, iPhone 6S, iPhone 6 Plus, iPhone 6G, iPhone 5S, iPhone 5C, iPhone 5G
    With Built-In Microphone
    51108001 / 8595217475397
    51108001 / 8595217475397
    Black