Home
Outils
Soldering Materials
QianLi 3D BGA Reballing Gold Stencil For iPhone 7/7 Plus

QianLi 3D BGA Reballing Gold Stencil For iPhone 7/7 Plus

Skip to the end of the images gallery

Skip to the beginning of the images gallery

SKU

APP13602

Marque

Outils , Apple

Type du produit

BGA Chip Ball Template Stencil

Êtes-vous un client professionnel (B2B)?

Êtes-vous un réparateur ou travaillez-vous dans le secteur des télécommunications ou dans le secteur technique?

Êtes-vous un client privé (B2C)?

Voulez-vous acheter ce produit en tant que client privé?
You can buy it directly from our partner via the following link: acheter

La description

Apple iPhone 7/iPhone 7 Plus BGA Chip reballing Stencil for Soldering IC Chips. Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight. Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate. The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation