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Sunshine SS-034 Apple iPhone 6S/iPhone 6S Plus BGA Chip Ball Template Stencil
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Beschreibung
Apple iPhone 6S/iPhone 6S Plus BGA Chip reballing Stencil for Soldering IC Chips.
Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight.
Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate.
The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation
Zubehör
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2m Long & 2mm WideCP-20YCP-20Y
Zubehör
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2m Long & 2mm WideCP-20YCP-20Y
Beliebte Produkte
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Kompatibel mit mehreren ModelleniPhone 14 Pro, iPhone 14 Pro Max, iPhone 14 Plus, iPhone 14, iPhone 13 Pro Max, iPhone 13 Pro, iPhone 13 Mini, iPhone 13, iPhone 12 Pro Max, iPhone SE (2022), iPhone 12 Pro, iPhone 12 Mini, iPhone 12, iPhone SE (2020), iPhone 11 Pro Max, iPhone 11 Pro, iPhone 11
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