Wylie BGA Reballing Stencil For iPhone - For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max
Sei un cliente aziendale (B2B)?
Sei un riparatore o lavori nel settore delle telecomunicazioni o tecnico?
o egistrarsia dealer account to view our pricing and stock availability.
Sei un cliente privato (B2C)?
Sei un cliente privato (B2C)?
You can buy it directly from our partner via the following link: Acquista
Descrizione
Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips.
Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight.
Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate.
The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation - For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max
Prodotti correlati
-
-
2m Long & 2mm WideCP-20YCP-20Y
Prodotti correlati
-
-
2m Long & 2mm WideCP-20YCP-20Y
Prodotti popolari
-
-
GH82-19204A / GH82-19713A / GH82-19714A / GH82-19289AGH82-19204A / GH82-19713A / GH82-19714A / GH82-19289ABlack -
Compatibile su più modelliiPhone SE (2020), iPhone 11 Pro Max, iPhone 11 Pro, iPhone 11, iPhone XR, iPhone XS Max, iPhone XS, iPhone X, iPhone 8 Plus, iPhone 8
