Wylie BGA Reballing Stencil For iPhone - For iPhone 12 / 12 Mini / 12 Pro / 12 Pro Max
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Descrizione
Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips.
Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight.
Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate.
The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation - For iPhone 12 / 12 Mini / 12 Pro / 12 Pro Max
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Compatibile su più modelliiPad 10th Gen. (2022), iPad Air 5 (10.9" / 2022) , iPad 9 (10.2) - 2021, iPad Pro 2021 (12.9) - (5th Gen), iPad Pro 11- 2021 (3rd Gen), iPad Mini 6, iPad Air 4 (2020), iPad Pro 11 (2nd Gen - 2020), iPad Pro (12.9) - (4rd Gen), iPad 8 (10.2) - 2020, iPad 7 (10.2) - (2019), iPad Mini 5, iPad Pro (11), iPad Pro (12.9) - (3rd Gen), iPad 6 (2018), iPad Pro (12.9) - (2nd Gen), iPad Pro (9.7) - (2nd Gen), iPad (2017), iPad Pro (12.9), iPad Pro (10.5) (2nd Gen), iPad Pro (10.5), iPad Pro (9.7), iPad Air 3 (10.5) - (2019), iPad Air 2, iPad Air, iPad Mini 4, iPad Mini 3, iPad Mini 2, iPad Mini, iPad 4, iPad 3, iPad 2, iPad 1
380mm x 220mm - 120℃CPB320CPB320Blue
