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MaAnt BGA Reballing Stencils For Samsung (S/Note/A Series)

Código
TOOL21156
Tipo de producto
BGA Chip Ball Template Stencil
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Descripción
● High-quality steel sheet stencil, more durable ● Precise laser cutting for better alignment ● High-temperature resistance, not easy to get deformed ● The CPU and the common fault ICs are integrated into one stencil ● IC numbers are lasered on the stencil for reference, much easier to find